{"product_id":"simulation-and-reliability-assessment-of-advanced-packaging-hardcover","title":"Simulation and Reliability Assessment of Advanced Packaging - Hardcover","description":"\u003cdiv\u003e\u003cp style=\"text-align: right;\"\u003e\u003ca href=\"https:\/\/reportcopyrightinfringement.com\/\" target=\"_blank\" rel=\"nofollow\"\u003e\u003cb\u003eReport copyright infringement\u003c\/b\u003e\u003c\/a\u003e\u003c\/p\u003e\u003c\/div\u003e\u003cp\u003eby \u003cb\u003eKuo-Ning Chiang\u003c\/b\u003e (Guest Editor)\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003eTopics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal\/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.\u003c\/p\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eNumber of Pages:\u003c\/strong\u003e 296\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eDimensions:\u003c\/strong\u003e 0.94 x 9.61 x 6.69 IN\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003ePublication Date:\u003c\/strong\u003e April 30, 2024\u003c\/div\u003e\n            ","brand":"BooksCloud","offers":[{"title":"Default Title","offer_id":47392305938681,"sku":"9783725809721","price":111.56,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0789\/2782\/3097\/files\/H88S1TlhUh9783725809721.webp?v=1770237093","url":"https:\/\/bookscloud.io\/products\/simulation-and-reliability-assessment-of-advanced-packaging-hardcover","provider":"BooksCloud Book Dropshipping","version":"1.0","type":"link"}